Thursday, 21 August 2014

'Made For Mobile' Microprocessors

"Mobile processors are designed with the approach of doing more with less. This is one of the reasons why you do not see x86-based smartphones today,” quips James Bruce, lead mobile strategist at ARM. In the case of desktop processors, power efficiency,size of the chip and thermal management are not limiting factors, though these are important design aspects. However, in the case of a mobile device, which needs to compete with a desktop in terms of functionality and at the same fit into your pocket, working for long hours on battery, these ‘mobility’ factors are critical.

Bruce explains that desktop processors are ‘processors on chip.’ Many surrounding chips are needed to complete the compute sub-system. On the other hand, in the mobile world, the complete sub-system is on a single chip—a system-on-chip (SoC).

“For example, you may have a 3G (or even 4G) modem, processor, graphics, video unit, audio decoder, Wi-Fi, Bluetooth, geographical positioning system (GPS), dynamic random-access memory (DRAM) and Flash, all in one 14×14mm² package,” Bruce says.



Praful Joshi, business development manager, Wind River India, concurs, “The key challenge to an engineer designing a mobile processor is how to add more functionality while design-ing an SoC without compromising on low power consumption or low form factor. In fact, the processor chip size is a very important factor. You can see new very-large-scale integration (VLSI) technologies such as 30 nm or less being widely used in mobile processors as against desktop processors.”

“Today, consumers expect to have the same kind of computing experience on their mobile device as on their desktop or notebook PC—high-definition(HD) video playback, audio and video streaming, multitasking, Web browsing, 3D gaming and 3D interfaces. However, the power envelopes of a PC and a mobile device are radically different. Simply miniaturising a traditional x86 CPU, which you would find in vast majority of PCs, is not enough. The resulting processor might physically fitinto a mobile device but its power consumption would result in a device with a battery life of minutes,” says Vishal Dhupar, managing director, Asia-South, NVIDIA.

Dhupar recalls that when creating NVIDIA’s mobile solution Tegra, their engineers had started from the ground up with a strict power budget. The designers had to fight for every milli watt of power. All of this shows that a mobile being different from a desktop, its processor also needs to be different.

War of the titans
Quite naturally, the repertoire of made-for-mobile microprocessors is also increasing, with many ARM-based offerings from Texas Instruments (TI), Qualcomm, NVIDIA, MediaTek, etc, and Intel Atom chips also catching up now.

“ARM is the most popular processor in the mobile device world. It is not a derivative of any desktop processor. It was designed specifically for low-power-consuming devices. Since then it has emerged as a mainstream mobile processor and added more computational capabilities and a software ecosystem. ARM licenses its core processors to SoC vendors such as TI, Qualcomm and others, who, in turn, add their own unique IP for different mobile markets,” says Joshi of WindRiver—an Open Source operating systems (Android, Linux and Tizen) commercialization partner for mobile processor designers as well as mobile device manufacturers.

ARM has several processors for designers to choose from, including the latest Cortex-A9, which features  2GHz typical operation with the TSMC 40G hard macro implementation, low-power targeted single-core implementations into cost-sensitive devices, and an optional NEON media and floating-point processing engine. It is also scalable up to four coherent cores with advanced MP Core technology.

ARM’s model of licensing its core processors to other vendors is a unique selling proposition. “Because desktop processors are really only available from two companies, there is limited innovation and diversity. Compare this to the ARM business model where any company can license an ARM processor and build its own unique intellectual property (IP) around its own unique configuration of ARM cores. This business model is very exciting as it provides opportunities for new companies in India to develop their own application processors for tablets or smartphones,” says Bruce.

Intel Atom processors are also emerging and gaining a market in mobile devices. These are derivatives of desktop processors like Pentium Core i5, i7, etc. The Intel Atom processor Z6xx combines 45nm Intel Atom processor core with 3D graphics, video encode and decode, as well as memory and display controllers into a single SoC design. Combined with the Intel SM35 Express chipset, it supports Windows, MeeGo and Android operating systems.

While the processor appears more popular in the net book space, a variety of smartphones and mobile Internet devices (MIDs) for cloud computing are also sporting the ‘Intel Inside’ logo these days. Joshi suggests that although ARM is a leader in the mobile space, Atom can benefit from the Intel’s experience in the desktop space as the current trend portrays a deep convergence of desktop and mobile worlds.

Multi-core magic
As mobiles race to beat the capabilities of computers, it is inevitable that some of the trends in the PC processor space will also spill over to the mobile world. One such trend is the magic of multi-cores.

“Due to the growth in the availability of high-speed mobile and WiFi networks, mobile devices will also be used for various performance-intensive tasks that were previously handled by traditional PCs. Single-core mobile processors are not designed to deal with this tidal wave of high-performance use cases,” explains Dhupar.

“On a mobile processor that has a multi-core CPU, multi-tasking can be shared between the distinct processing cores. Hence, as the performance requirements of mobile applications increase, SoC vendors are adopting multi-core processor architectures to deliver the increased performance and keep power consumption within mobile budgets,” he adds.

It is a common misconception that more cores mean higher power consumption. In fact, multi-core CPUs are able to distribute their workload across their cores so that each CPU core can run at a lower frequency and voltage. This means each core consumes significantly lower power and offers much higher performance per watt than single-core CPUs.

The performance of a smart phone has increased 40 times over the last ten years; and the increase in performance since 2008 alone has been eight times. One reason for this is the adoption of multi-core technology. Last year saw the launch of dual-core Cortex-A9 smartphones. This year, we are likely to see the launch of quad-core Cortex-A9 smartphones.

Bruce predicts that at the end of 2012, we will see the launch of Cortex-A15 handsets with a 50 per cent increase in performance. “Also in 2012 you will see the launch of Cortex-A15 based handsets at a $100 price point. The Cortex-A15 processor allows $100 smartphones to deliver the user experience of a $500 smartphone in 2010,” he says.

NVIDIA is also focusing on multi-core architectures. Its latest Tegra 3 processor goes a step beyond quadcore by adding a fifth‘companion’ core. Its internal architecture is identical to the four main Cortex-A9 CPU cores but the fifth core is built using a special low-power silicon process. Using a technology called variable symmetric multiprocessing, the fifth core handles low-frequency tasks such as those common in active standby mode (Twitter and Facebook updates, e-mail synchronization, etc) and applications that do not require significant CPU processing power, such as audio streaming, offline audio playback, an both online and offline video playback.

When more demanding tasks are required, the other four cores can be called upon. This approach allows Tegra 3 to deliver significantly lower power than competing mobile processors at all performance levels.

It is interesting to note that the popular low-cost, open mobile software development platform Panda Board too is now available in a dual-core version, keeping pace with the current trend. In November 2011, the community announced the availability of the Panda Board ES based on TI’s OMAP4460 processor, whose multi-core architecture includes two ARM Cortex-A9 cores running at up to 1.2 GHz each, delivering a 20 per cent increase in overall performance and a 25 per cent increase in graphics when compared to the OMAP4430 processor used by the earlier Panda Board.

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Article by
Dept. of ECE
Lakireddy Balireddy College of Engineering (LBRCE)

Lakireddy Balireddy College of Engineering (LBRCE)

A Highly Efficient Solar Lantern by Texas Instruments

A Street Light Solution - System Block Diagram
A Highly Efficient Solar Lantern Block Diagram



TI had designed solar lantern solution specifically for Indian rural market with circuit protections, more shelf life, user control interface with dimming feature and the most important thing, very high power efficiency providing great backup time.

Key Solution Features:

  • Boost Drive Stage for 3W (3 LEDs in Series)
  • Stand-by current < 500uAReverse
  • Polarity protection for Battery and Panel
  • 4 Stage Charging profile for Battery
  • User interface in form of Keys and Indication LEDs
  • Under-voltage Cutoff


TI Hero Products in this Solution

  • MSP430G2231
  • TLV70433
  • TPS61165

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Article by
Dept. of ECE
Lakireddy Balireddy College of Engineering (LBRCE)

Lakireddy Balireddy College of Engineering (LBRCE)

Golden Rules For Electronic Circuit Design

- All components must conform to the specified temperature range. For resistors, de-rating of power rating at peak temperature must be considered. For capacitors de-rating of capacitance, leakage and increase in ESR at peak temperature may be important. For other components such as diodes and transistors, parameters such as recovery times and current gain vary with temperature and must be considered at extreme temperatures. In summary, no design calculation must be left to chance (as is often the case with designs put together in haste), temperature effect calculations are indispensable to success.

- Devices connected to interfaces must be well protected from ESD (Electrostatic Discharge) damage. ESD damage may occur at the time of prototype construction, during manufacturing or during use. Contrary to common misconception ESD at the time of production may not render a device defunct, but may cause progressive deterioration which may result in field failure. Therefore built in ESD protectors are necessary and Mansi Engineering ensures that all its designs incorporate them where necessary. IEC 61000-4-2 is a widely accepted ESD test conformance standard. ESD protectors include MOVs, TVS diodes, ESD Protection Clamping diodes and the newly introduced Polymer based devices. Selection of the right type of protector depends on capacitance that can be tolerated without signal deterioration and other factors such as tolerable leakage current, cost, pin outs and board area required. In addition, ESD protectors must be placed as close as possible to the signal entry location and as far away as possible from the device being protected so that the resulting large trace impedance attenuates the high frequency ESD energy as it travels towards the protected device. Zener or TVS diodes must be placed between power supply lines and ground to absorb ESD energy traveling via other protector diodes towards power supply line, while the device is powered off.

- Terminals connecting to inductive sources must be protected from switching overshoots or undershoots using clamping diodes or other devices. Long traces that carry heavy currents may act as sufficiently large inductors to cause unwanted switching transients and therefore protection is necessary.

- Signal lines must be well protected from radiated and conducted EMI. Ferrite beads and capacitor filters are effective means to block EMI.

- Within limits of budget, every design must incorporate sufficient protections from wrong connections, such as battery polarity reversal and accidental grounding of an output line. Large resistors are recommended to be used in series with microprocessor outputs driving drivers that drive large inductive loads. This ensures that the processor is well protected from switching transients.

- Functioning of the system at power up must be analyzed. For example it is important to deploy pull-up resistors on microprocessor output signals that need to be high on power up. Similarly functioning of relevant parts when powering down deliberately or accidentally, must be analyzed. For example, when processor state saving is involved during power down, a power down detect functionality might prove indispensable.

- For EMC, it is recommended to use inductors (preferably shielded) to slow down sharp current rise and fall times. Sharp current transients cause a sharp varying and traveling electromagnetic field.

- It is important to assign test points to relevant nets. Especially all ground and power nets, bias or threshold points and other serviceable signals must have a test point, which add convenience during testing and troubleshooting. Test points may be free vias with suitable drill size to accept and retain stainless steel needles or header leads.

- Having an on board power on LED indicator has its own importance. It warns the engineer and people around that the circuit is live and prevents accidents."


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Article by
Dept. of ECE
Lakireddy Balireddy College of Engineering (LBRCE)

Lakireddy Balireddy College of Engineering (LBRCE)

OPTO Coupler

An optocoupler, also called opto-isolator, is an electronic component that transfers an electrical signal or voltage from one part of a circuit to another, or from one circuit to another, while electrically isolating the two circuits from each other...!!

Photo: OPTO Coupler....  An optocoupler, also called opto-isolator, is an electronic component that transfers an electrical signal or voltage from one part of a circuit to another, or from one circuit to another, while electrically isolating the two circuits from each other...!!  for more stuff like : ALL About Electronics


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Article by
Department of EEE
Lakireddy Balireddy College of Engineering (LBRCE)


Lakireddy Balireddy College of Engineering (LBRCE)

How A Cell Phone Call Works

Photo: How A Cellphone call works...!!  for more stuff join : ALL About Electronics  |


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Article by
Dept. of Electronics & Instrumentation Engineering
Lakireddy Balireddy College of Engineering (LBRCE)


Lakireddy Balireddy College of Engineering (LBRCE)




Family of Microcontrollers




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Article by
Dept. of ECE
Lakireddy Balireddy College of Engineering (LBRCE)


Lakireddy Balireddy College of Engineering (LBRCE)

Lakireddy Balireddy College of Engineering (LBRCE) , Mylavaram

About LBRCE :

     Lakireddy Balireddy College of Engineering is an ISO 9001:2008 Certified institution, approved by AICTE, Accredited by National Assesment and Accreditation Council (NAAC) with 'A' Grade and National Board of Accreditation (NBA). It has spacious campus spread over 60 acres, of serene and natural surroundings with plenty of greenery in Mylavaram, Krishna District. It has sufficient infrastructure with an administration block of 60,000 sq.ft. It facilitates AC Auditorium, AC Conference- room, well equipped laboratories, free internet with 28mbps leased line, a world class Library server with 4.5 tb back up area, an extension counter of Central Bank of India, H.T.Power supply two generator sets of capacity 375 kva, a new generator of capacity 250 kva is purchased, excellent canteen to cater to the needs of students and staff.

 The College got Autonomous status by UGC. We have 8 UG Courses (EEE,ECE,EIE,CSE,IT,Mechanical,AeroSpace & Civil Engineering) and 7 PG Courses (MCA,MBA, M.Tech(CSE),M.Tech(SSP),M.Tech(SE),M.Tech(TE)) & M.Tech(Power Electronics & Drives). Several highly qualified and experienced quality faculty have been inducted already.

     The College got Center of excellence Award of Jawahar Knowledge Centre and also obtained star status. The CSS and Placement department is full fledged headed by a true Professional and full time faculty imparting soft skills. The College is aiming to achieve 100% placement this academic year. It has tied up with several public sector and Multinational Companies.

Vision :

     To empower the students to become technologically vibrant, innovative and emotionally matured and to train them to face the challenges of the quality conscious globalized world economy.

Mission :

  • To provide an environment most conducive to learning and to create a stimulating intellectual atmosphere on the campus.
  • To achieve Academic Excellence.
  • To ensure a holistic development of personality.
  • To spread education to rural areas.
  • To establish partnership between Institution & Industry.

Lakireddy Balireddy College of Engineering (LBRCE) , Mylavaram